Architect CHUB smart glasses and non peripheral communication modules from the ground up. Lead design and prototyping of EEG, fNIRS, IMU, PPG, EDA, and thermal sensors. Integrate mixed signal ASICs at 10 to 12 nm. Deliver minimal form factor, sub 50 ms latency, sub 1 µV noise floor, and skin safe optics across helmet, backpack, and belt pack deployments.
Responsibilities
- Architect multi layer PCBs for temple analog front ends and digital radio circuits.
- Integrate dry and semi dry electrodes and spring loaded NIR sources.
- Specify and validate ASICs at 10 to 12 nm with secure enclave support.
- Define mechanical interfaces for backpack, neckband, and optional ECoG clinical grids.
- Lead bench, phantom, and thermal testing to meet IEC 60601-1 and optical safety thresholds.
Qualifications
- MS or PhD in EE, Bioengineering, or related field.
- 5+ years in neural interface hardware or medical device design.
- Hands on experience with mixed signal ASICs, sensor integration, and PCB layout.
- Proven track record of prototype validation and regulatory compliance.
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